Opportunities · Internship
2027 Undergrad ASIC Package Engineering Co-op/Intern
AMD · Multiple US locations
Applies on the employer's siteNew to UTern today
Role overview
About this opportunity
- AMD is seeking an undergraduate intern or co-op to prototype real silicon and boards in ASIC package engineering.
- This role suits students interested in hands-on hardware development.
Requirements and eligibility
- Eligibility requirements are not available in the listing details we have.
Dates for this one
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First seen by UTern
Sep 13, 2026
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Read the full listing context
AMD is seeking an undergraduate intern or co-op to prototype real silicon and boards in ASIC package engineering. This role suits students interested in hands-on hardware development.
Verified by UTern
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