Opportunities · Research opportunity · Spring 2027

Strategic Student Program: Cross-Domain Electronics Systems Engineering Intern (T&I, Spring 2027)

Siemens Digital Industries Software

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Pay: about $30-$50/hr
When: Spring 2027
Where: Detroit, MI

Before you apply

GPA: Minimum 3.0 GPA
Work authorization: Authorized to work in the United States without the need for current or future sponsorship by the company
Availability: System Engineering Intern (Year-Round)

What you'll do

Research and evaluate emerging engineering technologies and workflows
Develop software prototypes, automation tools, and proof-of-concept solutions
Explore digital, analog, semiconductor, PCB, and system-level design concepts
Document technical findings through white papers, tutorials, and technical guides
Investigate AI-assisted engineering and documentation workflows
Learn and utilize industry-leading EDA and PLM tools

What they want

Required

Currently enrolled as a university student (MS or PhD or Undergraduate with plans to pursue graduate degree)
Available to work Full-time starting Spring 2027
Hybrid – Wilsonville, OR; Detroit, MI
Pursuing a Bachelor's, Masters, or Ph.D. degree in Mechanical Engineering, Robotics Engineering, Electrical Engineering, Computer Engineering, Computer Science, Electronics Engineering, or related STEM field
Strong analytical and problem-solving skills
Excellent verbal and written communication skills

Nice to have

Exposure to digital logic, FPGA, embedded systems, or electronics design
Interest in EDA, PLM, automation, or AI technologies
Experience with Python, C++, or other programming languages
Familiarity with Linux or scripting environments

Pay and perks

The hourly range for this position is $18.00 to $50.00.
Paid volunteer time off

About Siemens Digital Industries Software

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Strategic Student Program: Cross-Domain Electronics Systems Engineering Intern (T&I, Spring 2027)

Siemens Digital Industries Software

Detroit, MI

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Strategic Student Program: Cross-Domain Electronics Systems Engineering Intern (T&I, Spring 2027)

Siemens Digital Industries Software

Detroit, MI

1 day ago

108 applicants

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Siemens Industry Software Inc.

Strategic Student Program (SSP)

Discover your career with us at Siemens Industry Software!

We are a leading global software company dedicated to the world of computer aided design, 3D modeling and simulation - helping innovative global manufacturers design better products, faster! With the resources of a large company, and the energy of a software start-up, we have fun together while creating a world class software portfolio. Our culture encourages creativity, welcomes fresh thinking and focuses on growth, so our people, our business, and our customers can achieve their full potential.

We’re currently recruiting students for our Spring 2027 Strategic Student Program. Our intern positions will allow you to find a career path that most inspires you. Here, you will apply your education to solve real-world problems and turn theory into practice. At Siemens, our goal is to empower our students to become the next leaders of our company.

Baseline requirements

Currently enrolled as a university student (MS or PhD or Undergraduate with plans to pursue graduate degree)
Minimum 3.0 GPA
Available to work Full-time starting Spring 2027
Authorized to work in the United States without the need for current or future sponsorship by the company
Hybrid – Wilsonville, OR; Detroit, MI

Perks

Potential for full-time offers after university graduation and completion of the program
Mentorship from senior engineers
Individual career development planning
Networking with our global leaders
Professional and technical workshops
Leadership opportunities
Energetic student community
Paid volunteer time off
Employee discounts at our top customer sites

For more information regarding our Early Career programs and the Strategic Student Program please visit our website: Student Programs and Early Careers

Cross-Domain Electronic Systems Engineering Intern

About The Team

The Cross Product Solution Management (CPSM) team researches and develops innovative solutions that demonstrate how modern engineering disciplines work together across semiconductor design, electronics, software, mechanical engineering, AI, and Product Lifecycle Management (PLM).

This internship offers the opportunity to contribute to a "silicon-to-rack" engineering initiative that showcases the integration of EDA, PLM, and AI-enabled workflows across the entire product development lifecycle.

What you'll do

As an intern, you will work with senior engineers and technical specialists to:

Research and evaluate emerging engineering technologies and workflows
Develop software prototypes, automation tools, and proof-of-concept solutions
Explore digital, analog, semiconductor, PCB, and system-level design concepts
Document technical findings through white papers, tutorials, and technical guides
Investigate AI-assisted engineering and documentation workflows
Learn and utilize industry-leading EDA and PLM tools
Help define and demonstrate an end-to-end engineering digital thread from silicon design through system deployment

Areas of Exposure

Depending on project assignments, interns may gain experience in:

C++ and Python development
High-Level Synthesis (HLS)
Semiconductor and IC design methodologies
Analog and digital electronics
3D-IC and advanced packaging concepts
PCB design and signal integrity
Mechanical design integration
Product Lifecycle Management (PLM)
Technical documentation and workflow development

Required qualifications

Pursuing a Bachelor's, Masters, or Ph.D. degree in Mechanical Engineering, Robotics Engineering, Electrical Engineering, Computer Engineering, Computer Science, Electronics Engineering, or related STEM field
Strong analytical and problem-solving skills
Excellent verbal and written communication skills
Ability to learn quickly and work independently
Self-motivated, curious, and adaptable

Preferred qualifications

Exposure to digital logic, FPGA, embedded systems, or electronics design
Interest in EDA, PLM, automation, or AI technologies
Experience with Python, C++, or other programming languages
Familiarity with Linux or scripting environments
Previous internship, co-op, or project experience a plus

Position Objective

Contribute to the research, development, and documentation of a reference "silicon-to-rack" product development workflow demonstrating how modern EDA, PLM, and AI technologies connect semiconductor design, system design, mechanical engineering, and lifecycle management into a unified engineering ecosystem.

The initiative spans IC design, packaging, PCB, mechanical, and PLM domains within an integrated engineering workflow.

The hourly range for this position is $18.00 to $50.00. Siemens offers a variety of health and wellness benefits to employees. The actual compensation offered is based on the successful candidate’s work location, as well as degree type and relevant education. Details regarding our benefits can be found here: www.benefitsquickstart.com. In addition, this position is eligible for time off in accordance with Company policies, including paid sick leave and paid volunteer time off.

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Seniority level

Internship

Employment type

Full-time

Industries

Software Development

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Posted

Sep 3, 2026

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