Opportunities · Internship
Intern, Process Engineering (Advanced Packaging)
ASM · Singapore
Applies on the employer's site≈$27-$51/hr
Role overview
What you'll own
- Develop advanced surface preparation solutions for hybrid bonding interconnect applications.
- Design, execute, and analyze experiments to evaluate process performance and identify opportunities for improvement.
- Collaborate closely with ASM’s Advanced Packaging R&D team on leading-edge technology development.
- Present findings and recommendations based on experimental results and data analysis.
Requirements and eligibility
- Currently pursuing a Bachelor's, Master's, or equivalent degree in Electronics Engineering, Materials Science, Mechanical Engineering, Systems Engineering, or a related field.
- Strong interest in semiconductor manufacturing processes and advanced packaging technologies
- Ability to analyze technical data and communicate findings clearly.
- Effective teamwork and problem-solving skills
Preferred, not required
- Knowledge of semiconductor process technologies.
- Experience with material surface characterization techniques.
- Strong data analysis and interpretation skills.
Dates for this one
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Posted
Aug 13, 2026
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