Opportunities · Part-time opportunity · Summer 2027
Silicon Photonics Advanced Packaging Intern
GlobalFoundries · Malta, NY
Applies on Workday≈$76-$89/hr
Dates for this one
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Posted
Sep 3, 2026
What matters in this listing
What you'll own
- Support Silicon Photonics advanced packaging innovation and customer design enablement by contributing to packaging design rules, product requirements, and efficient manufacturing processes with internal teams and OSAT ecosystem partners.
- Develop and apply analysis or simulation models to evaluate package performance, manufacturability, cost, and quality, and document findings and recommendations for engineering stakeholders.
Requirements and eligibility
- Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation.
- Required Qualifications:
- Actively pursuing a Bachelor’s or Master’s degree in Electrical Engineering , Mechanical Engineering, Materials Science, Photonics, Optical Engineering, Packaging Engineering or a related field through an accredited degree program during the internship.
- Must have at least an overall 3.0 GPA and be in good academic standing.
Preferred, not required
- Prior related internship, research, or co-op experience in semiconductor packaging, photonics, optics, or advanced electronics.
- Demonstrated leadership experience through academic projects, student organizations, competitions, or prior employment.
- Strong interest in leveraging AI tools and emerging technologies to enhance productivity, streamline workflows, and support effective decision-making.
Verified by UTern
Pay is stated in the listing, not inferred from a range.
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