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Opportunities · Part-time opportunity

Process Engineering Intern (Hybrid Bonding)

Amat · Singapore, Singapore

Applies on Workday≈$10-$45/hr

Dates for this one

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Posted

Aug 31, 2026

What matters in this listing

What you'll own

  • we do together advances the world’s technology.
  • You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
  • We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.
  • Visit our Careers website to learn more.

Requirements and eligibility

  • Qualified intern students with good intern performance will be given priority consideration to join core development team after graduation.
  • Relocation Eligible:
Read the full listing context

The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry.

The work we do together advances the world’s technology. What We Offer Location: Singapore,SGP You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.

We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go.

Learn more about our benefits . Looking for young passionate interns with characteristics of strong hands-on, analytical thinking, and self-motivated learning to join our core technology team.

Qualified intern students with good intern performance will be given priority consideration to join core development team after graduation. Field of Work • Advanced packaging - hybrid bonding system development.

• Exposure to independent operation of a variety of industrial & lab surface/ material/ structural/ topographic metrology & inspection tools commonly used for hybrid bonding technology.

Exposure to cleanroom environment. Key Responsibilities • Design, collect data, analyze and compile reports on entry-level process engineering experiments, under supervision and within safety guidelines • Support process engineers on tool development, DOE execution, data collection, and data analysis & interpretation to characterize industrial system under development Functional Knowledge • Demonstrates conceptual knowledge in own discipline and broadens capabilities Leadership • No supervisory responsibilities but interact with co-workers and resources to accomplish assigned projects Problem Solving • Solves problems in straightforward situations; analyzes possible solutions using technical experience and judgment and precedents Impact • Impacts quality of own work and the work of others on the team; works within guidelines and policies Interpersonal Skills • Explains complex information to others in straightforward situations Additional Information Time Type: Full time Employee Type: Intern / Student Travel: No Relocation Eligible: No Applied Materials is an Equal Opportunity Employer.

Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

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